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2017 년 교육 계획

2014 년 교육 계획
분기 차수 일시 내용 정원
1/4 31차 2017.01.19 Basic Course:
Microstructures Sample preparation for Metallurgy
20명
32차 2017.02.09 Basic Course:
Microstructures Sample preparation for Electronic Materials
20명
70차 2017.03.09 MultiPrep System Users Meeting:
Cross-Section/ TEM Wedge Sample Preparation
6명
2/4 33차 2017.04.13 Basic Course:
Microstructures Sample preparation for Metallurgy
20명
34차 2017.05.18 Basic Course:
Microstructures Sample preparation for Electronic Materials
20명
71차 2017.06.15 MultiPrep System Users Meeting:
Parallel Thinning for Die & Package Analysis
6명
3/4 35차 2017.07.13 Basic Course:
Microstructures Sample preparation for Metallurgy
20명
36차 2017.08.24 Basic Course:
Microstructures Sample preparation for Electronic Materials
20명
72차 2017.09.14 MultiPrep System Users Meeting:
Cross-Section/ TEM Wedge Sample Preparation
6명
4/4 37차 2017.10.19 Basic Course:
Microstructures Sample preparation for Metallurgy
20명
38차 2017.11.09 Basic Course:
Microstructures Sample preparation for Electronic Materials
20명
73차 2017.12.14 MultiPrep System Users Meeting:
Parallel Thinning for Die & Package Analysis
6명

MultiPrep System

교육대상 : MultiPrep System
교육참가비용 : 10 만원/1 인 (단, 장비보유고객 1인/1회 무상)
교육참가인원 : 선착순 6 명
강사: 센터장 및 담당연구원
 
1. Cross-Section/TEM Wedge Sample Preparation
Cross-Section/TEM Wedge Sample Preparation
10:00AM ~ 10:50AM MultiPrep system application
11:00AM ~ 11:50AM Equipment Calibration 교육 및 실습
12:00AM ~ 01:00PM 점심식사
01:15PM ~ 02:40PM Sample 제작1 (Cross-section)
03:00PM ~ 06:00PM Sample 제작2 (Wedge Cross-section)
2. Parallel Thinning for Microelectronic device / SIMS sample preparation
Parallel Thinning for Microelectronic device / SIMS sample preparation
10:00AM ~ 10:50AM MultiPrep system application
11:00AM ~ 11:50AM Equipment Calibration 교육 및 실습
12:00AM ~ 01:00PM 점심식사
01:00PM ~ 02:10PM Sample 제작1 (Parallel Thinning/ Sample preparation)
02:30PM ~ 04:00PM Sample 제작2 (Back-side Thinning/ Thinning 실습)

Basic Course

교육대상 : 미세조직 관찰법을 배우려는 초보자(금속분야, 전자재료분야)
교육참가비용: 5 만원/1 인
교육참가인원 : 선착순 10 명
강사: 센터장 및 담당연구원
 
1. Microstructures Sample preparation for Electronic Materials
Microstructures Sample preparation for Electronic Materials
10:00AM ~ 11:00AM 시편준비방법 및 관찰법
11:10AM ~ 11:50AM Sectioning 장비 작동법 및 실습
12:00AM ~ 01:00PM 점심식사
01:15PM ~ 02:15PM Cold Mounting 실습
02:30PM ~ 03:30PM Polishing 실습 1
03:50PM ~ 05:00PM Polishing 실습 2
2. Microstructures Sample preparation for Metallurgy
Microstructures Sample preparation for Metallurgy
10:00AM ~ 11:00AM 시편준비방법 및 관찰법
11:10AM ~ 11:50AM Sectioning 장비 작동법 및 실습
12:00AM ~ 01:00PM 점심식사
01:15PM ~ 02:15PM Hot Mounting/Cold Mounting 실습
02:30PM ~ 03:30PM Polishing 및 관찰 실습 1
03:50PM ~ 04:40PM Polishing 및 관찰 실습 2